CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment
Funding
Not specified
Deadline
--
Days
--
Hrs
--
Min
--
Sec
Nov 01, 2026
Posted Sep 29, 2023 (875 days ago)
Closes Nov 1, 2026 (in 253 days)
Grant Details
Opportunity Number
2023-NIST-CHIPS-SMME-01
CFDA / ALN
11.037
Opportunity Category
Discretionary (D)
Funding Category
Science and Technology (ST)
Funding Instrument
Cooperative Agreement (CA)
Cost Sharing
No Cost Sharing (No)
Eligibility
Others (25)
An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.
Description
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email [email protected].
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